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UB100S

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UB100S SPECIFICATION & THERMAL DATA
Attachment chart msk
PCB thickness
(mm)
(in)
Chip Height
(mm)
(in)
Chip Contact Area Square  
x
(mm)
x
(in)
Package Size Square  
x
(mm)
x
(in)
Input Unit
Attachment Method (Select one of the below)
ss
mm
(in)
ss
(mm)
(in)
mm
in
ss
(mm)
(in)
Search result filter
mm
in

-
The minimum attachment pressure is 5(psi).
%
-
%
mm
Shoulder Screw Attachment
mm
mm
Heat Sink Height mm
Base Thickness mm
x mm
Note : The unit prices are the same whichever you select.
 Working Load Shoulder screwSpring Spr.Rate
N/mmlbf/in

mm

mm

%
Pressure
mmin
NkgfN/mm2kgf/cm2psi
Model Name :
UB100S-
B
-

 

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Model Name: 
Quantity
catalog3D CADRoHSREACH
Step 1: Select Heat Sink Height
Step 2: Select shoulder screw and spring
Step 3: Select TIM
Heat Sink Height (h)
 Shoulder ScrewsSprings
Thermal Interface

Note

The thermal interface materials listed here are phase change materials (PCMs).

These PCMs are naturally tacky and will be pre-applied to the heat sink. However, PCMs may peel-off from the heat sink base when removing the release liner prior to heat sink installation. Since PCMs rely on their natural tackiness instead of an adhesive, this can happen.

In light of this, we recommend that our customers apply additional pressure to the PCMs prior to removing the protective liner to allow the PCMs to wet out on the heat sink surface (refer to instruction item #4 below).

Storage and Handling Instruction

  • To order individual components, such as shoulder screws or springs, please visit each link/page.
  • If heatsink customization (size, hole layout, etc...) is required, we recommend using the online customization tool.
    MOQ is 1 piece, typical lead time is 1-2weeks.
Dimension and thermal dataBoard keep out pattern

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