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Accessory - Thermal Interface Material

TITLE Thermal Interface Material Picture

Thermal interface material fills the small gaps and irregularities between the heat sink and heat source to minimize the interface thermal resistance. The following interface materials are typically available with our products. These materials can also be purchased separately.

Reference : Thermal Interface Material Data

This page does not include adhesive tape for heat sink attachment. Please visit Thermally Conductive Adhesive Tape for heat sink attachment tape.
Gap Filling Material
These materials have high thermal conductivity and are soft, allowing them to fill any large gaps between the heat sink and heat source.
Phase Change Material
These materials begin to soften and flow at a certain temperature, filling the microscopic irregularities between heat sink and heat source, reducing the thermal interface resistance.
Thermal Grease
Thermally conductive grease. Compared to other type of thermal interface materials, grease offers the highest performance.

Specification

Gap Filling Material
T-PLI210
TypeT-PLI210
Standard Size
Model Name
Please select size from above list.

T-PLI210-EB SPEC T-PLI210-QB SPEC T-PLI210-HB SPEC
T-PLI210 Picture
PropertyDescription
ColorRose
Operating Temperature-45degC - 200degC
Thermal impedance0.16 degC-in2/W
(@ 20psi)
Specific Gravity1.44
Thickness0.25(mm) [.010"]
Thermal conductivity6 W/mK
Laird Technologies
#T-pli 210A1FG
T-PLI220
TypeT-PLI220
Standard Size
Model Name
Please select size from above list.
T-PLI220 Picture
PropertyDescription
ColorBlue
Operating Temperature-45degC - 200degC
Thermal impedance0.21 degC-in2/W
(@ 20psi)
Specific Gravity1.43
Thickness0.51(mm) [.020"]
Thermal conductivity6 W/mK
Laird Technologies
#T-pli 220A1
T-FLEX640
TypeT-FLEX640
Standard Size
Model Name
Please select size from above list.
T-FLEX640 Picture
PropertyDescription
ColorBlue-Violet
Operating Temperature-45degC - 200degC
Thermal impedance0.62 degC-in2/W
(@ 10psi)
Specific Gravity1.34
Thickness1.02(mm) [.040"]
Thermal conductivity3 W/mK
Laird Technologies
#T-flex 640
(Thickness and size are in inches. 1" is 25.4mm)

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Phase Change Material
T-PCM905C
TypeT-PCM905C
Standard Size
Model Name
Please select size from above list.

T-PCM905C-EB SPEC T-PCM905C-QB SPEC T-PCM905C-HB SPEC
T-PCM905C Picture
PropertyDescription
ColorYellow
Operating Temperature-25degC - 125degC
Thermal impedance0.048 degC-in2/W
(@ 10psi)
Specific Gravity1.3
Thickness0.125(mm) [.005"]
Thermal conductivity0.7 W/mK
Laird Technologies
#T-pcm905C
Storage and Handling Instruction
TPCM585
TypeTPCM585
Standard Size
Model Name
Please select size from above list.
TPCM585 Picture
PropertyDescription
ColorGray
Operating Temperature-40degC - 125degC
Thermal impedance0.020 degC-in2/W
(@ 10psi)
Specific Gravity2.87
Thickness0.127(mm) [.005"]
Laird Technologies
#T-pcm 585
Storage and Handling Instruction
(Thickness and size are in inches. 1" is 25.4mm)

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Thermal Grease
YG6260 - 5
YG6260 Picture
PropertyDescription
ColorWhite
Operating Temperature-50degC - 150degC
Thermal conductivity0.84 W/mK
Specific Gravity2.5
Weight5 g
Momentive Performance Materials
(formerly GE Toshiba Silicones) #YG6260
G751-1
G751 Picture
PropertyDescription
ColorGray
Operating Temperature-50degC - 120degC
Thermal conductivity4.5 W/mK
Specific Gravity2.5
Weight1 g
Shin-Etsu Chemical
#G751

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