Online Catalog

Vapor Chamber

VC Series

This series features high thermal conductivity vapor chambers.
Vapor Chambers quickly spread high heat density over a wide area, enhancing cooling efficiency.

Comparison of Temperature Trends between the Vapor Chamber (VC120) and a Copper Plate.

Vapor Chamber

(Above picture shows Vapor Chamber cross section)

The inner wall of the thin copper container is bonded with a copper mesh, and a porous wick is placed at the heat source. The working fluid, pure water sealed under vacuum conditions, continuously evaporates and condenses, circulating through the wick by capillary action, efficiently dissipating heat.

The video on the left shows the temperature distribution when a 15x25mm heater is in contact with a product of 120mm square and 3mm thickness.
Compared to copper, the vapor chamber (VC120)
maintains a more uniform temperature over
a wider area, effectively suppressing
the temperature rise at
the heat source.

If the shape or size does not meet your requirements, please contact our sales department.

Supplement

Working temperature range: 10 - 90°C.

Model	Size W x L (mm)	Hole Pitch X x Y (mm)	Hole Dia ⌀H	Weight (g)	Download		Availability / Price / Order
Model	Size W x L (mm)	Hole Pitch X x Y (mm)	Hole Dia ⌀H	Weight (g)	Data sheet	Others	Availability / Price / Order
VC80	80 x 80	70 x 70	5.5	87.3
VC90	90 x 90	80 x 80		114.3
VC100	100 x 100	90 x 90		142.5
VC120	120 x 120	110 x 110		203.4
VC106x70	106 x 70	96 x 60	5.9	101.1

Measurement setup 1 (Bare die / Water cooling)

A vapor chamber was placed on a heater with a thermocouple, and its top surface was cooled using a water-cooling block. The thermal resistance value was based on the temperature rise of the heater relative to the water inlet temperature. Thermal grease was applied at each interface.

Thermal resistance (°C/W) : (Tj - Tw) / Watts

Model	Power(W)
Model	100	200	400
VC80	0.094	0.088	0.08
VC90	0.079	0.074	0.069
VC100	TBD	TBD	TBD
VC120	0.078	0.073	0.066
VC106x70	0.091	0.086	0.077
Without vapor chamber	0.104	0.099	0.094

Heat source size : 15 x 25 (mm), Water flow rate 4.0 (L/min)

Measurement setup 2 (With Lid / Water cooling)

A copper plate assuming a heater cover was placed between a heater with thermocouples and a vapor chamber, and the top surface of the vapor chamber was cooled by a water-cooling block. The thermal resistance value was based on the temperature rise of the heater relative to the water inlet temperature. Thermal grease was applied at each interface.

Thermal resistance (°C/W) : (Tc - Tw) / Watts

Model	Power(W)
Model	55	200
VC80	0.267	0.223
Same size copper	0.329	0.300
VC90	0.267	0.224
Same size copper	0.318	0.294
VC100	0.265	0.219
Same size copper	0.324	0.298
VC120	0.251	0.213
Same size copper	0.334	0.301
VC106x70	0.265	0.225
Same size copper	0.334	0.304

Heat source size : 12 x 22 (mm), Water flow rate 0.6 (L/min)

Measurement setup 3 (Bare die / Active fan)

A vapor chamber was placed on top of a heater with thermocouples attached, and its top surface was cooled by a heat sink with a fan. Thermal resistance value was based on the temperature rise due to the heater relative to the temperature of the incoming air from the top of the fan. Thermal grease was applied at each interface.

Thermal resistance (°C/W) : (Tj - Ta) / Watts

Model (Combination)			Power(W)
Heatsink	Vapor Chamber	Fan	55	100
^*1 FH10040A (Base 4mm thick, All Al)	VC90	M92P	0.404	0.384
^*2 FHC10040A (Al + Cu embedded)	None		0.494	0.489
^*3 FH10040A (All Al)	None		0.610	0.609

^*1 Custom FH10040A (Base thickness 4mm + VC 3mm = 7mm)

^*2 Standard FHC10040A (Base thickness 7mm)

^*3 Standard FH10040A (Base thickness 7mm)