Online Catalog

Pad / Cushioning Material Specification

Pad and Intake Cover
Pad / Cushioning Material Specification

Primary use would be on packages with an exposed die. The edges and corners of the die can be damaged if the heat sink is not level when installed. The pads can be installed on the heat sink or the device's substrate. The pad material will cushion the heat sink and keep it level while the push pins, screws, or clips are installed.

Model Name: {{ITEMNAME_PAD}}
  Model Size
(mm)
Thickness
(mm)
UL Design Notes Download
 Data Sheet Other
sp Φ 7 x 8
per sheet

2.135

Sponge:


  UL94HF-1

Adhesive, one side

Density:


  0.180g/cm³

Hardness:


  10 deg(c type)

25% compression load:


  0.029 - 0.058MPa

catalog RoHS REACH

1.150

Sponge:


  —

Adhesive:


  UL94VTM-0

Adhesive, one side

Density:


  0.4g/cm³

25% compression load:


  0.015MPa
catalog
sp 32 (Outside)
23 (Inside)
catalog

© 2025 Alpha Novatech, Inc.