Announcement of new XFP Heat Sink
Issue Date: 2012/05/15
XFPU Series Picture

Alpha has expanded its wide range of off-the-shelf products to meet with our customer's requirements.

We have released a new series of passive heat sinks for XFP transceiver modules. The heat sinks will utilize Alpha's unique MicroForged fins which offer significantly improved performance and lower pressure drop. Multiple height versions will be available to meet with various mechanical and thermal requirements including PCI, SAN, and Networking environments.

The heat sinks will be compatible with standard EMI cage assemblies and clips. If one of the standard heights does not meet with a particular application environment, a semi-custom version can easily be accommodated with minimal impact to lead time and cost.

Details (drawings, thermal data, etc...) are available from our online catalog.

© 2012 Alpha Novatech, Inc.